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EN
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Indium is a malleable metal with a low melting point (157℃). With Sn, Pb, Ag etc., it can form a series low melting point eutectic solders .
Features & Benefits
·? Low melting point
·? Low vapour pressure
·? Favorable ductility and malleability
·? Good thermal fatigue properties
·? Repeatable welding and reflow soldering at low temperature is available.
·? Nice resistance in drop tests?
·? Superior thermal conductivity
Product Application
Indium has a high thermal conductivity (86W / mK at 85°C). Therefore, it is widely used in thermal management, and the heat generated by electronic components can be effectively eliminated through it.
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·? Vacuum electronic devices packaging
·? Glass packaging
·? Ceramic packaging
·? Low-temperature superconductive device packaging
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Model
|
|---|
| In51Bi32.5Sn16.5 |
| In66.3Bi33.7 |
| Bi50Pb28Sn22 |
| In52Sn48 |
| Sn50In50 |
| In80Pb15Ag5 |
| In97Ag3 |
| In100 |
| In60Pb40 |
| Sn77.2In20Ag2.8 |
| In50Pb50 |
| Pb60In40 |
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Solid Line
°C |
Liquidus
℃ |
Eutectic Alloy
℃ |
Density
g/cm3 |
Resistivity
μΩ.m |
Thermal Conductivity
W/m.K |
Thermal Expansion Coefficient
10-6/℃ |
Tensile Strength
Mpa |
|---|---|---|---|---|---|---|---|
| / | / | 60 | 7.88 | 0.522 | / | 22 | 33.44 |
| / | / | 73 | 7.99 | / | / | / | / |
| / | / | 100 | / | / | / | / | / |
| 120 | 122 | / | 7.3 | 0.147 | 34 | 20 | 12 |
| 118 | 125 | / | 7.3 | 0.147 | 34 | 20 | 11.86 |
| 149 | 154 | / | 7.85 | / | / | / | / |
| / | / | 143 | 7.38 | 0.075 | 73 | 22 | 5.5 |
| / | / | 157 | 7.31 | 0.072 | 86 | 29 | 1.88 |
| 174 | 185 | / | 8.52 | 0.246 | 29 | 27 | 28.61 |
| 175 | 187 | / | 7.25 | 0.176 | 54 | 28 | 46.88 |
| 184 | 210 | / | 8.86 | 0.287 | 22 | 27 | 32.2 |
| 197 | 231 | / | 9.3 | 0.331 | 19 | 26 | 34.48 |